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Rendered at 22:48:40 07/28/25
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Estimated to arrive by Fri, Aug 8th.
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FREE via USPS Media Mail (2 to 9 business days) to United States
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OBO - Seller accepts offers on this item.
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PayPal accepted
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Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Shipping options
Estimated to arrive by Fri, Aug 8th.
Details
FREE via USPS Media Mail (2 to 9 business days) to United States
Offer policy
OBO - Seller accepts offers on this item.
Details
Return policy
Purchase protection
Payment options
PayPal accepted
PayPal Credit accepted
Venmo accepted
PayPal, MasterCard, Visa, Discover, and American Express accepted
Maestro accepted
Amazon Pay accepted
Nuvei accepted
Item traits
| Category: | |
|---|---|
| Quantity Available: |
Only one in stock, order soon |
| Condition: |
Very Good |
| ISBN: |
9780070563063 |
| Format: |
Hardcover |
| Type: |
Textbook |
| Language: |
English |
| Publication Year: |
1989 |
| Seller Notes: |
“VERY GOOD CONDITION.” |
| Book Title: |
Principles of Electronic Packaging Hardcover |
| Features: |
EX-LIBRARY |
| Series: |
Mcgraw-Hill Series in Materials Science and Engineering |
| Subject Area: |
Technology & Engineering |
| Publication Name: |
Principles of Electronic Packaging |
| Author: |
Ronald C. Lasky, Donald P. Seraphim, Che-Yu Li |
| Publisher: |
McGraw-Hill Higher Education |
| Subject: |
Industrial Design / Packaging |
| Number of Pages: |
962 Pages |
Listing details
| Shipping discount: |
Seller pays shipping for this item. |
|---|---|
| Posted for sale: |
More than a week ago |
| Item number: |
1720116916 |
Item description
This hardcover textbook titled "Principles of Electronic Packaging" is a valuable resource for anyone interested in the subject area of Technology Engineering. Published by McGraw-Hill Higher Education in 1989, this book provides comprehensive information on the industrial design and packaging of electronic devices. It has a total of 962 pages and is part of the Mcgraw-Hill Series in Materials Science and Engineering.
The book was written by Ronald C. Lasky, Donald P. Seraphim, and Che-Yu Li, and features an ex-library status. The format of the book is hardcover and it is published in English. This textbook is a must-have for anyone seeking to deepen their knowledge of electronic packaging and industrial design.
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- Handling time 3 days. Estimated delivery: Fri, Aug 8th
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